Even under normal operating conditions, Microelectronic devices can sometimes reach internal temperatures which are detrimental to the performance and reliability of the component.  This can be a result of many factors, including the surrounding environment, power consumption of the device, and package design.  In the event the package that the microcircuit is mounted in cannot disperse the generated heat quickly enough, it often becomes necessary to attach an external heat sink to improve the dissipation characteristics.  WEB Automation offers a complete line of heat sinks designed specifically for thermal management of semiconductor packages.  These components are available in a variety of designs with either omni-directional or flow dependent configurations for natural or forced convection applications.

WEB Automation specializes in the mass production of machined components.  Using state-of-the-art CNC equipment, WEB Automation can offer customers superior quality products at very affordable prices.  Tolerances of less than +/- 1 mil are routinely achieved when required.  Completed units are visually and dimensionally screened to customer specified statistical sampling plans using a full set of inspection equipment including a coordinate measuring system.